There is, however, always a small amount of contact resistance.

Silver also has the lowest contact resistance of any metal.

It should also be noted that the contact resistance may vary with temperature.

The problem of contact resistance can be overcome by using four electrodes.

This temperature change may be attributed to what is known as the thermal contact resistance.

The wipers are nickel silver based for low contact resistance.

The intercept of the line with the y-axis, is two times the contact resistance.

Measurements of thermal conductivity are also subject to contact resistance.

This process can increase the contact resistance, superheat the relay and lead to fires.

The inverse of this property is termed thermal contact resistance.

Thereafter a sudden 'run-away' increase in contact resistance to an an open circuit value.

In this design, the contact resistance in the area of the schoopage is the lowest.

There is also the contact resistance between the welding electrodes and the workpiece.

A sufficiently high contact resistance can cause substantial heating in a high current device.

The relatively high contact resistance can already be a problem for some DC and very low frequency circuits.

This phenomenon is said to be a result of a thermal contact resistance existing between the contacting surfaces.

Low contact resistance multiplexing of the individual inputs ensures optimal stability.

Accumulation of debris has an adverse effect on the critical measurement of contact resistance.

A four point probe is used to avoid contact resistance, which can often be the same magnitude as the sheet resistance.

Thermal contact resistance is defined as the ratio between this temperature drop and the average heat flow across the interface.

So is a connector is removed too many times, the contact resistance increases and this can cause heating.

Where the joint is unprotected and accessible to moisture, a significant rise in electrical contact resistance can occur.

Second, contact resistance between each layer in the device should be minimized to offer higher fill factor and power conversion efficiency.

Specific contact resistance can be obtained by multiplying by contact area.

To decrease the thermal contact resistance, the surface roughness can be decreased while the interface pressure is increased.