However, there is no fundamental need for lead in the solder alloy.

Soldering alloys are usually categorised as either 'soft' or 'hard'.

Solderability varies depending on the type of solder alloy under discussion.

Jim Moffatt focuses upon the high strain fatigue behaviour of solder alloys.

The values are only a guide to the relative strength of identical joints made with the solder alloys at room temperature.

Different elements serve different roles in the solder alloy:

Silver solder alloys now rarely contain it.

The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed.

All solder alloys are Pb-free.

Cadmium, present in some older silver solder alloys can, in extreme cases, cause loss of consciousness within a matter of minutes.

Obtaining maximum benefit from a Fusion brazing or soldering alloy depends, in part, on fast, error-free application.

Soldering, by contrast, uses a solder alloy that is some compatible alloy showing eutectic behaviour.

However, we are cognisant of the additional complexities, such as high strain rate sensitivity and microstructural instability, which surround solder alloys.

(see also solder alloys)

Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).

Soft soldering uses a filler that melts at a lower temperature than the workpiece, often a lead-tin solder alloy.

A useful table of various solder alloy liquidus temperatures can be found in an article hosted at the EMPF.

We had the pleasure of working with leading suppliers to the electronics industry to put together a production feature using pin-in-hole reflow and lead free solder alloys.

Nickel can be added to the solder alloy to form a supersaturated solution to inhibit dissolution of thin-film under-bump metallization.

The document prescribes the nomenclature, requirements and test methods for electronic grade solder alloys relating to fluxed and non-fluxed solders.

The term "reflow" is used to refer to the temperature above which a solid mass of solder alloy is certain to melt (as opposed to merely soften).

Thick gold metallization also limits choice of soldering alloys, as tin-based solders dissolve gold and form brittle intermetallics, embrittling the joint.

When forming soldered joints the appropriate solder should be specified according to BS EN 29453: 1994 - Soft solder alloys.

Ryaztsvetmet offers a selection of lead powder and feathered tin, solder alloys, Babbitts, lead pipes and goods (anodes & wires)